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Ionic winds can be harnessed for a 250 p 5b4 ercent increase in the heat-transfer coefficient to cool integrated circuits. Details... more...

Despite some possible short-term 5b4 glitches, a feeling of cautious optimism has finally spread throughout the DRAM industry following a downturn in the first half of 2007. Details... more...

TSMC has approved capital appropriations totaling $59.8 million for use in establishing 300-mm, wafer-level packaging technology. Details... more...